322-Washington,America - 23
Emergency Call- 24/7 support
Home » Packaging » Packaging Material and Equipment » PPA-9190218
* For discount/customization and buying a particular chapter click here or write to us at email@example.com
Embedded die is a integrated circuit or passive electronic component which is placed or formed in the inner layer of a chip package, organic circuit board or module. Embedded die packaging technology is the technique to insert or embed the semiconductor die directly into Printed Circuit Board (PCB) laminated substrate. Embedded die packaging technology provides many advantages such as improved electrical and thermal performance, compact size, opportunity for cost reduction, heterogeneous integration, streamlined logistics for Original Equipment Manufacturers (OEMs) etc. The global embedded die packaging technology market is expected to rise at a CAGR of 14.8% during forecast period 2016-2023. Due to its advantages, embedded die packaging technology is being extensively used in various sectors such as consumer electronics, IT & telecommunication, automotive, healthcare etc. Furthermore, the embedded die platform provides opportunity for true System-in-Package (SiP) architectures with much higher levels of integration than the incumbent multi-chip module at much lower costs than the 2.5D Through Silicon Via (TSV) platform.
The key factor driving the growth of global embedded die packaging technology market is the increasing number of portable electronic devices. Most extensively used portable electronic device is the smartphone. According to Pew Internet Research Center, in 2016, approximately 92% of the youth population of age between 18 to 29 years have access to smartphone and 42% of elderly population of age 65 or more owns smartphone which has increased from 18% in 2013 at global level. Moreover, due to increasing number of internet users, there has been increased adoption of mp3 players, i-pods, smart TV, laptop and other portable electronic devices. According to International Telecommunication Union (ITU), around 3.19 billion users in 2015 which raised to around 3.74 billion internet users are present across globe in 2017 (that is 48% of world population in 2017). Moreover, as per ITU, Asia has the highest number of internet user in the world that is around 1.87 billion in 2017. Such 1.87 billion users represent around half of the total internet user present across the globe. Whereas, America has the highest internet user penetration rate of around 88% of total population in 2016. Therefore, increasing number of portable electronic devices is contributing significantly to the growth of global embedded die packaging technology market.
Source: OBRC Analysis.
The report on global embedded die packaging technology market includes platform type and end users.
Platform types included in global embedded die packaging technology market report are:
The end users of embedded die packaging technology include:
The report scope is widely categorized on the basis of its platform types which include embedded die in IC package substrate, embedded die in rigid board and embedded die in flexible board. Moreover, end users include consumer electronics, IT & telecommunication, automotive, healthcare etc.
The global embedded die packaging technology market report has been geographically segmented in:
Rest of World
North America is the largest market region for global embedded die packaging technology market in terms of market revenue share. The key factors driving the growth of North American embedded die packaging technology market are the surging demand and adoption of IoT devices, growing telecommunication and automotive industry. Embedded die packaging technology is extensively used in embedded systems such as microcontroller chips and integrated circuits, digital signal processor. These electronic components are then used in mobile phones, mp3 players, digital cameras etc. Furthermore, North America has the largest number of smartphone users. According to Pew Internet Research Organization in 2014, approximately 59% of people in North America use smartphone that increased to 77% in 2016. Furthermore, according to Pew Research Center, out of total population in North America, approximately 78% men and 75% women were recorded to use smartphones in 2016. Therefore, increasing number of smartphone users in North America would increase the demand for embedded die packaging technology thereby contributing to the North American market growth. . Asia Pacific is expected to emerge as the fastest growing market region owing to the presence of key market players such as Fujikura, ASE group, Taiwan semiconductor manufacturing company etc. in Asia Pacific region.
Global embedded die packaging technology market report covers segmentation analysis of platform type and end users. Report further covers segments of platform types which include embedded die in IC package substrate, embedded die in flexible board and embedded die in rigid board.. Embedded die in IC package substrate is the leading platform type segment owing to its increased adoption in DC-DC converters and camera modules which are used in smartphones. Whereas, end users of embedded die packaging technology include consumer electronics, IT & telecommunication, automotive, healthcare etc. The IT and telecommunication is the dominating end user segment as embedded die packaging technology are widely used in smartphones, routers, etc.
The major market players of the global embedded die packaging technology market are:
These companies using various strategies such as merger & acquisition, collaboration, partnership and product launch. Whereas, merger & acquisition is the key strategy adopted by the companies in the embedded die packaging technology market.
For Example: On September 2015, Advanced Semiconductor Engineering (ASE) Inc. signed a joint venture agreement with TDK corporations to set up a new company named ASE Embedded Electronics Incorporated in order to manufacture IC embedded substrates using Semiconductor Embedded in Substrate technology of TDK Corporation. This joint venture was a result of strategic initiative to expand the customer base.
On March 2017, Amkor Corporations announced to provide services for wafer processing such as high volume electroplated wafer solder bumping for the packaging of 300 mm wafers in order to expand the customer base.
The report covers detailed analysis of companies which comprises of overview, SCOT analysis, product portfolio, strategic initiative, strategic analysis, competitive landscape and market share analysis in embedded die packaging technology market.
Key reason to buy the report:
How we are different from others:
At Occams we provide an extensive portfolio which is comprehensive market analysis along with the market size, market share, and market segmentations. Our report on global embedded die packaging technology market offers detailed analysis of strategic models such as investment vs. adoption model, see saw analysis and others strategic models. Also, the report contains the detailed analysis of application, adoption scenario and decision support for each segment. The report discusses competitive landscape of the embedded die packaging technology market, with giving extensive SCOT analysis of key companies.
Key findings of the global embedded die packaging technology market: